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Passivation structuring and plating for semiconductor devices
US patent 11387095
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Statements
instance of
United States patent
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title
Passivation structuring and plating for semiconductor devices
(English)
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country
United States of America
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owned by
Infineon Technologies (Austria)
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author name string
Ravi Keshav Joshi (Klagenfurt)
series ordinal
1
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Andreas Behrendt (Villach)
series ordinal
2
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Richard Gaisberger (Velden)
series ordinal
3
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Anita Satz (Villach)
series ordinal
4
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Johanna Schlaminger (Villach)
series ordinal
5
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Johann Schmid (Villach)
series ordinal
6
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Mario Stanovnik (Villach)
series ordinal
7
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Juergen Steinbrenner (Noetsch)
series ordinal
8
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significant event
filing
point in time
21 August 2020
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consent
point in time
12 July 2022
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Identifiers
patent number
US11387095
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