(Q123568397)

English

Passivation structuring and plating for semiconductor devices

US patent 11387095

Statements

Passivation structuring and plating for semiconductor devices (English)
0 references
Ravi Keshav Joshi (Klagenfurt)
0 references
Andreas Behrendt (Villach)
0 references
Richard Gaisberger (Velden)
0 references
Anita Satz (Villach)
0 references
Johanna Schlaminger (Villach)
0 references
Johann Schmid (Villach)
0 references
Mario Stanovnik (Villach)
0 references
Juergen Steinbrenner (Noetsch)
0 references
21 August 2020
0 references
12 July 2022
0 references

Identifiers

0 references
 
edit
    edit
      edit
        edit
          edit
            edit
              edit
                edit
                  edit