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Semiconductor device and manufacturing method thereof
US patent 11476223
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instance of
United States patent
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title
Semiconductor device and manufacturing method thereof
(English)
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country
United States of America
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owned by
Toshiba
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Toshiba Electronic Devices & Storage Corporation
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author name string
Daisuke Koike (Tokyo)
series ordinal
1
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Fumiyoshi Kawashiro (Tokyo)
series ordinal
2
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significant event
filing
point in time
29 January 2020
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consent
point in time
18 October 2022
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Identifiers
patent number
US11476223
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