Wikidata

(Q118175683)

English

Connecting a component to a substrate by adhesion to an oxidized solder surface

US patent 11228124

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Statements

title
Connecting a component to a substrate by adhesion to an oxidized solder surface (English)
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owned by
IBM
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author name string
Mark K. Hoffmeyer (Rochester, MN)
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Steven P. Ostrander (Poughkeepsie, NY)
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Thomas Weiss (Poughkeepsie, NY)
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Thomas E. Lombardi (Poughkeepsie, NY)
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significant event
filing
point in time
4 January 2021
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consent
point in time
18 January 2022
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Identifiers

patent number
US11228124
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