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Qualcomm Snapdragon 845
system-on-chip developed by Qualcomm
Snapdragon 845
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Statements
instance of
system on a chip model
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subclass of
Qualcomm Snapdragon
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part of the series
Qualcomm Snapdragon
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follows
Qualcomm Snapdragon 835
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followed by
Qualcomm Snapdragon 855
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fabrication method
10 nm lithography process
1 reference
reference URL
https://www.qualcomm.com/news/releases/2017/12/06/qualcomm-snapdragon-845-mobile-platform-introduces-new-innovative
GPU
Adreno 630
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developer
Qualcomm
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official website
https://www.qualcomm.com/products/snapdragon-845-mobile-platform
language of work or name
English
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code name
hoya
(English)
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date of commercialization
2018
1 reference
reference URL
https://www.qualcomm.com/news/releases/2017/12/06/qualcomm-snapdragon-845-mobile-platform-introduces-new-innovative
announcement date
6 December 2017
place of publication
Hawaii
URL
https://www.qualcomm.com/news/releases/2017/12/06/qualcomm-snapdragon-845-mobile-platform-introduces-new-innovative
1 reference
reference URL
https://www.qualcomm.com/news/releases/2017/12/06/qualcomm-snapdragon-845-mobile-platform-introduces-new-innovative
has part(s)
Snapdragon X24 LTE Modem
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Qualcomm Quick Charge 4.0
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