(Q61950450)

English

Quantitative analysis of strengthening mechanisms in thin Cu films: Effects of film thickness, grain size, and passivation

scientific article published in May 1998

Statements

Quantitative analysis of strengthening mechanisms in thin Cu films: Effects of film thickness, grain size, and passivation (English)
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R-M. Keller
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S. P. Baker
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May 1998
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13
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05
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1307-1317
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